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2021-01-28 23:33 developer |
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Hi henry Here is feedback as your DFM agenda. Thanks SON |
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Hi Henry updated feedback see below. Thanks SON |
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Hi SH Plz find attached updated DFM. 1. All DFM issues were provided, including ownerships for both Fii and ALT's 2. The tab "ALT owned" was updated with I column (the reply for ALT's feedback) and new items 7, 8, 14, 17 (marked yellow that Fii provided the proposal in neighboring tabs for review) Thanks, Henry |
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Hi Henry updated feedback see below. Thanks SON |
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Hi Henry Here is DFM review for DVT1 sample by ALT Please check attachment file Thanks SON KakaoTalk_20210219_153032557.mp4 (402,763 bytes) |
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Hi SH Son, Here is the 3D data for housing modified and BT antenna assembly proposal. Please check attachment file Thanks Jim |
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Hi SH Per discussion last week I updated the DFM and also plz refer to the above 3D file to discuss with Inkel and let us know if any updates. Thanks Henry |
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Hi SH Son, Here is the 3D data for housing modified and the updated SoC bottom heatspreader. Please check attachment file Thanks Jim |
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Hi SH Son, Here is the length of speaker cable proposal for DFM item 4. Please check attachment file Thanks Jim |
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@Jim 0001131:0006306 Screw boss height change 6mm to 4mm is confirm. will update modeling data. I will request another mantis 0001031 to marge other PCBA data with new soc bottom heatspreader. 0001131:0006338 checked. we will update cable length for new amp board with your suggestions Thanks SON |
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Hi Jim reply 0001131:0006338 I update speaker cable drawings. I applied as your suggestion. Please check your recommendations are applied correctly. also I attached bottom housing 3d modeling data and speaker 3d modeling data. THIS IS NOT A FINAL DATA, Please use only for review speaker cable assembly Thanks SON |
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Hi Henry Here is update as we discussed agenda. 0001131:0006137 Please find the attachment file Thanks SON |
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Hi SH Thanks for your updates. For item 14 I think Inkel should also consider the DFM and improve...since the tooling modification is the fixed cost but the extra manpower for locking a different screw would be the variable cost. Thus the cost will be either on Inkel or Fii takes into consideration in MoH. As to the rest ME Jim will review within this week. @Jim Plz help complete the review within this week and raise questions if any. Thanks Henry |
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@Jim 0001131:0006428 Please check and feedback within today. Today is dead line for DVT3 cable drawing out to vender. Thanks SON |
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Hi SH Son, 0001131: 0006496 Here is the length of speaker cable proposal for DVT3. Please check attachment file Thanks Jim |
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connector change.PNG (142,663 bytes) |
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Hi SH Son, Here is the cable routing for DVT3. And we need to turn the FFC connector to 90 degrees for assembly issue, so need to modify the hole on the bottom cover. Please check attachment file Thanks Jim |
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HI JIM Reply 0001131:0006515 this request is not acceptable due to tooling started center(PCBA) area. this is too late. Also, Don't change LED board connector direction Thanks SON |
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@Jim We want to check, is can adjust the height between amp top heat spreader and soc top heat spreader : (current) 15mm to (adjust) 12mm Because, we are consider Inductors from other vendor due to acoustic performance. But another vender inductor is higher than now. – about 6.5mm If adjust the height between amp top heat spreader and soc top heat spreader 15mm to 12mm, we can use to it. But it is need Fii help. Please check and let us know. amp top_soc top.png (157,284 bytes) |
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Hi SH Son, Reply 0001131:0006565 After checking with our thermal team, it is OK to change the height between amp top heat spreader and soc top heat spreader 15mm to 12mm. But we will use the old material on DVT3, so the the height between amp top heat spreader and soc top heat spreader is also 15mm on DVT3. Please know that. Thanks Jim |
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Hi SH, Reply 0001131:0006565 Is the inductor "SPH10040-100M" from LS communication to be changed? We already placed PO for 6500pcs on way and 2306 stock on hand...which means if the vendor cannot sell the part somewhere else then there will be obsolete cost. (To be checked later) Besides this change will also affect the ME structure of heatspreader which will need to have the vendor re-make and it takes normally 4 weeks to ship out from China...Could you find the substitute with same height? Thanks, Henry |
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Hi Henry reply 0001131:0006586 Still we are under review it. not yet change decision. I understood status of PO, stocks, and ME structure LT . We will review it comprehensively and let you know the final direction. Thanks SON |
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Hi SH, Thanks for your reply. About the issue of heatspreader SoC top and power inductor, we will apply DVT2 design in DVT3 build. Best, Henry |
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Hi Henry Please check with the vendor if can cancel PO 6500pcs of "SPH10040-100M" or can revise the Q'ty for DVT3? Because you have 2306pcs stock on hand, so check the total usages of "SPH10040-100M" for DVT3 then cancel the extra PO, thanks. |
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Hi henry I want to check make sure before inductor changes. 1. First, please apply common mode filter BPPM00121190172X0F for DVT3. 0001143:0006575 a. check deadline for MP PO. "BPPM00121190172X0F " b. ALT will review the apply or not during KC certification. 2. about Inductor we are under review for apply "SWPA8065S100MT". this vender - sunload is Fii QVL vendor. a. Plan to running change : use DVT3 "SPH10040-100M" from LS communication : use first MP 100pcs, The remaining amount q'ty is canceled PO : apply new inductor "SWPA8065S100MT" form sunload for 2nd MP b. Please check Leadtime for "SWPA8065S100MT" form sunload. I want to discuss the timing of the running change. 3. heat spreader a. for DVT3 assembly, - can use DVT2 stocks for SoC Top / BOT, if possible assembly with new amp top/bot heat spreader 0001143:0006415. - can not use DVT2 stocks for AMP Top / BOT : please prepare to fit the new amp board 0001143:0006415 : I will make separately request b. for MP, as confirmed form Jim 0001131:0006577 Please apply on the thermal solution together " change the height between amp top heat spreader and soc top heat spreader 15mm to 12mm" if you have any question, please contact me. Thanks SON |
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1. First, please apply common mode filter BPPM00121190172X0F for DVT3. 0001143:0006575 a. check deadline for MP PO. "BPPM00121190172X0F " b. ALT will review the apply or not during KC certification. [Henry] Will apply the specified common mode filter for DVT3. The MP PO release has been overdue...we only have less than 2 months left before pre-MP in mid June. I think this part LT is longer than 60 days... 2. about Inductor we are under review for apply "SWPA8065S100MT". this vender - sunload is Fii QVL vendor. a. Plan to running change : use DVT3 "SPH10040-100M" from LS communication : use first MP 100pcs, The remaining amount q'ty is canceled PO : apply new inductor "SWPA8065S100MT" form sunload for 2nd MP [Henry] As checked with distributor of LS COM, they can hold the stock 6500pcs till May 20. We have 2306pcs on hand and enough for 288pcs of FG. If the pre-MP also uses SPH10040-100M we will have to import another lot from LS COM. I will check with vendor the MPQ to reduce the imported qty. When could ALT confirm to cancel the remained open PO? b. Please check Leadtime for "SWPA8065S100MT" form sunload. I want to discuss the timing of the running change. [Henry] 12 WKs. 3. heat spreader a. for DVT3 assembly, - can use DVT2 stocks for SoC Top / BOT, if possible assembly with new amp top/bot heat spreader 0001143:0006415. - can not use DVT2 stocks for AMP Top / BOT : please prepare to fit the new amp board 0001143:0006415 : I will make separately request [Henry] We will apply new AMP heatspreaders in DVT3 and ME will update the drawing to you. b. for MP, as confirmed form Jim 0001131:0006577 Please apply on the thermal solution together " change the height between amp top heat spreader and soc top heat spreader 15mm to 12mm" [Henry] I think the thermal solution is still under discussion... |
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Hi SH Son, Here is the new cable routing and heatspreaders for DVT3. Please check attachment file Thanks Jim |
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Hi Henry 0001131:0006674 We reviewing plan for SWAN BMT. - BMT will using new amp board. So, we need new AMP heatspreaders in DVT3 before BMT start. Please check new AMP heatspreaders (Top/Bot) 30pcs send to Korea until 4/16. Thanks SON |
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Hi SH, Heatspreaders with design updated by ME Jim on 0001131:0006681 will be implemented in DVT3. Currently it is in production, extra request will start from the material preparation and I will have to check with vendor the LT including the raw material. Besides, the current manufacturing applies the soft tooling(because our thermal solution is not finalized yet) and the cost is high...if you confirm to request for extra heatspreaders, I will have Tiffanie provide the quotation. Thanks Henry |
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HI Henry OK Please make quotation to us with lead time. after ALT will review DVT2 with new amp board for BMT sample, will confirm it. Thanks SON |
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Hi Henry, When will you fix Thermal spreader for AMP B'd ? I think we should fix the thermal spreader design to keep the DVT3 schedule. Please give your plan for thermal solution. |
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Hi Mr. Yoon, DVT3 heatspreader design is confirmed as the drawing in 0001131:0006681 shows. However, the final thermal solution is not firm as the customer doesn't agree to loosen the spec or modify the ME structure despite the fact that Fii reminded at the very beginning there will be thermal failure. |
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Hi SH, For those 2 heatspreaders (AMP top and AMP bottom) the LT is 4WKs. Tiffanie will provide the quotation to ALT no later than 4/21. (Plz be noted the sample price was negotiated and the vendor will need ALT to provide the FEDEX account for the shipment) We will wait for your confirmation to start. Thanks Henry |
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Hi Henry Chiou 0001131:0006787 actually BMT will start 5/3. ALT needs at least 3 days to rework. so, Please check asap, DVT3 stocks for (AMP top and AMP bottom) sent to Korea first, additional PO heatspreaders ship to VN factory for DVT3 assembly. Thanks SON |
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Hi SH, Plz advise the FEDEX account for the vendor to ship out 30 sets of DVT3 AMP top and bottom heatspreaders. Expected ETD 4/28. |
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Hi SH AMP heatspreader*30 sets shipped out by DHL with tracking 7758704785 |
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Hi Henry 0001131:0006674 About DVT3 heatspreader, I was replied "can use DVT2 stocks for SoC Top / BOT". But, as a thermal test result. we can not accept use the DVT2 stocks for SoC Top / BOT. due to DVT3 units will use BMT, KC certification. it need to same as MP condition - Mechanical design, Thermal solution and HW design. So, Please apply DVT3 SoC Top / BOT heat spreader. if you have any problem about this, please let me know. Thanks SON |
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Hi SH We don't have time to prepare materials requested for DVT3 now...It's about 3 WKs production and the raw material preparation LT is not included... The solution is to ask for samples and rework later. Plz check how many samples and when they are needed. Thanks Henry |
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Hi Henry, I checked minimum q'ty is 20 set heat spreader. I think TW office has some of samples, Please check and let us know. Thanks SON |
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Hi SH, Plz check when do you need the samples. From now on Tiffanie will reply to your request~ Thanks Henry |
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Hi Henry, No matter how late it is necessary until end of this month. It is best when assembled in DVT3 with new heat spreader. Please check the scheduel Thanks SON |
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Hi SH, Regarding to extra new sample request, I've sent quotation to Steve, and need ALT's confirmation. Thanks Tiffanie. |
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Hi Mr. Yoon and SH, I attached the DFM that we discussed with our factory about ALT related design and MOH issues. Please check and reply by 10/4. |
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Hi Ms. Sheila Tu, I attached our feedback. Please check it. We commented each item you mentioned on the document. |
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Hi, Ms. Sheila Tu, I changed a item ITEM 4 in "MOH cost down DFM" Tab. From : 2. We will check to use same Torque for M3x10. To : 2. We will check to use same screw for M3x10 2pcs and M3x7 2pcs (Torque 3~3.5kgf*cm). |
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Hi SY Yoon & SH, Please find the attached file is assembly DFM updated from factory. Please help to check and reply. Thanks Jim |
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Hi SY Yoon & SH, I add some item in the DFM, please check this file. Thanks Jim |
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Hi Mr. Yoon, Confirmed with teams that DFM on 8459 is the final version if parties don't change the production method/process anymore. |
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Hi Jim Please upload the updated mechanical SOP for first MP. ALT and Inkel will be review and feedback to you before next assembly Thanks SON |
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Hi SH, I will update the SOP to you ASAP. Thanks Jim |
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Hi Sheila Tu, According to today's meeting minute, I updated on "Double side acetic Tape" in DFM document. It already discussed with below mantis ID(https://mantis.cnsbg.foxconn.com/vaas/view.php?id=1177) My comment is [10/22] ALT tested alternative solution, but it cannot meet SKT's requirement. So we should keep using this "double side acetic tape". And this component cannot be attached in Sponge_MIC_Silicon. So please keep doing as Pre-MP. |
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Hi SH, 0001131:0008490 Please find the updated SOP for first MP. Thanks Jim |
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Hi SH, Please help to check the SOP that Jim uploaded today. We have to submit the document to our factory today so that they can train the OPs based on it. Thank you. |
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Hi Jim 0001131:0008571 Please see the ALT Feedback also attached rib cutting guide for Top case related below issue https://mantis.cnsbg.foxconn.com/vaas/view.php?id=1362 Thanks SON |
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Hi SH, For page. 19, would you comment why ALT require to change M3*10 4kgf to M3*7 3kgf at this moment? It impacts the production plan because 1. Fii doesn't have time to issue EC for material change. 2. MOH will be cost up for operator increasing (ALT require to change not only screw spec but also torque). |
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Hi Ms. Sheila Tu, You can keep original screw M3x10 with 3~3.5Kgf*cm instead of M3x7 with 3Kgf*cm that Mr. SH Son recommended in above SOP revision. We tried to reduce your MOH. So if you can reduce MOH when you use M3x7 instead of M3x10, then you can use it. But you can keep M3x10 screw. |
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Hi Carey here is ALT/Inkel feedback about DFM issue. Sorry for late update, Please refer to the attachment file If you have any question, please contact me Thanks SON |
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HI SH & Sophie & Mr. Yoon, Please see attached file updated by Fii factory team. Also, need ALT's help to feedback below issue ASAP: 1) Inkel Housing stock Qty? When will Inkel provide the improved housing? (Inkel should improve the housing after 13K pcs, please verify it.) 2) ALT will consider and feedback if the SPEC can be adjusted on 11/30. 3) ALT will provide the visual inspection criteria before 12/3. BR, Carey Lu |
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Hi Carey Lu about No.33 could you please explain that why ALT & Inkel have to pay for the rework? we think the root cause is PCBA - FFC Connector was changed by FII any noticed. as you know that this change was applied DVT3 stage. 2) ALT will consider and feedback if the SPEC can be adjusted on 11/30. -> Please see the my email. Thanks SON |
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Hi SH, About no.33, after checking with ME/ HW RD, as the issue is caused by the change from Fii, so for the 13K housing rework, should not charge ALT side. However, the housing after 13K pcs, we will need Inkel to provide improved housing, if not, the rework cost should be responsible on ALT/Inkel side. Thanks! Carey |
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Hi Carey Lu about No.19 Could you please more details? I was tested it, it was validated for short term. Thanks SON |
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HI Jim @G6007893 Please check SH's feedback on No.19 and help to provide more details, thanks! |
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Hi Carey Lu the excel file just described only in text I want to check - How did factory rework. - after assembly, the gap between side deco / bottom ""[ALT 1126]ALT requests to provide short term solution test data and if any issue found during production, pls take photos and inform ALT to feedback. [Fii] Fii already tried to follow ALT instruction and use the 1mm EVA cushion to opposite the boss, but result is not improved." Thanks SON |
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Hi SH, 0001131:0008820 The gap issues between side deco / bottom has improved a lot in the build, Most gap is less than 0.5mm. We will continue to pay attention to this issue. Thanks Jim Chen |
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Hi SH， Please find the attached file is the button issues proposed by our factory, please check. Thanks Jim Chen |
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No more action. So, close this issue. |
- yk.jung ( (ALTech) Younkwang Jung ) developer
